Amkor Assembly & Test (Shanghai) Co., Ltd.
Location
Shanghai
Founded
2001-08-28
Website
Risk Signals
431 news mentions monitored
Industry Context
This company is tracked across risk categories, including those related to its sector (e.g., Semiconductors and Related Devices, Electronic Parts and Equipment, Not Elsewhere Classified, Business Services, Not Elsewhere Classified), including supply chain integrity, ESG practices, labor disputes, and regulatory compliance.
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Recent Articles about Amkor Assembly & Test (Shanghai) Co., Ltd.
Live alerts from global media, monitored by Business Radar
2025-02-07 (arizonadailyindependent.com)
Eagles In … Phoenix? The 41-Year-Old Deal That Nearly Rewrote NFL And Philadelphia History – Arizona Daily Independent
By Brevan Branscum PHOENIX – Last December, executives from Tempe-based semiconductor company Amkor Technology won the NFL’s approval to acquire a 3.25% stake in the Philadelphia Eagles. Eagles owner Jeffrey Lurie sold the minority stake to Susan Kim, chairman of the board of Amkor. As the Eagles head off to play in Super Bowl 59...
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2025-01-10 (nhandan.vn)
Create a vision, reach for dreams
With the determination to make Vietnam a leading center for the semiconductor field in the region and the world, the Government has issued the Vietnam Semiconductor Industry Development Strategy to 2030 and vision to 2050, along with many other factors. Preferential policies encourage investment and promote businesses to participate in the semiconductor industry.
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2025-01-02 (pcpress.rs)
DOC Finalizes Payment of Nearly $7 Billion to Samsung, Texas Instruments and Amkor Chipmakers | PC Press
The US Department of Commerce (DOC) announced Friday that Samsung, Texas Instruments and Amkor Technology have received awards totaling more than $6.75 billion through the CHIPS Incentives Program. This program aims to expand the domestic production of semiconductors. Funding Details Samsung received up to $4.745 billion in direct funding, which is less than the
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2024-12-21 (electronicsmedia.info)
Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production to the U.S
The Biden-Harris Administration has awarded Amkor Technology $407 million under the CHIPS Incentives Program to build an advanced semiconductor packaging facility in Arizona. The investment will create over 4,000 jobs and strengthen the U.S. supply chain for cutting-edge AI and semiconductor technologies.
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2024-10-31 (statista.com)
Amkor Technology net income 2023
The net income of Amkor Technology with headquarters in the United States amounted to 362.13 million U.S.
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2024-10-07 (thuonggiaonline.vn)
The real estate industry strongly attracts FDI capital
FDI capital flowing into real estate in the first 9 months of the year was nearly 4.4 billion USD, accounting for nearly 17.7% of total registered investment capital...
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2024-09-12 (phunuvietnam.vn)
Attracting foreign investment capital FDI, Bac Ninh province ranks first in the country
Bac Ninh province's foreign investment (FDI) attraction in the first 8 months of 2024 reached over 3.4 billion USD, ranking first in the country.
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2024-07-26 (reuters.com)
US to award Amkor up to $400 million for chip packaging plant
The U.S. Commerce Department said on Friday it plans to award Amkor Technology up to $400 million in government grants to help fund the company's planned $2 billion advanced semiconductor packaging facility in Arizona.
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2017-06-15 (siliconsemiconductor.net)
Amkor Technology, Supplier of the Year by Qualcomm - News
Our selection of industry specific magazines cover a large range of topics.
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(fierceelectronics.com)
CHIPS award would support Amkor’s $2B packaging and test in Arizona
Prior to passage of the $52 billion US CHIPS Act in 2022, chip packaging and testing industry officials raised concerns that most of the billions could go to chip fabrication companies like Intel a | Amkor to work with 2.5D packaging tech at new facility with preliminary CHIPS grant of $400M
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(semiengineering.com)
Chip Industry Week In Review
Amkor-TSMC deal; new law speeds semiconductor projects; NSTC launch; quartz supply; chiplet partitioning; semiconductor materials; ferroelectric devices; data center power; data routing in heterogeneous chip designs.
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(theedgemalaysia.com)
Amkor wins US$600 mil in US grants, loans for chip packaging
Amkor Technology Inc is in line to receive US$400 million (RM1.87 billion) in US government grants and about US$200 million in loans for an advanced chip packaging project in Arizona, marking the latest award from a programme designed to boost American semiconductor manufacturing.
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