ANSYS HELLAS SINGLE MEMBER S.A.
Location
Sterea Ellada and Evoia
Founded
2000-07-11
Website
Risk Signals
234 news mentions monitored
Industry Context
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Recent Articles about ANSYS HELLAS SINGLE MEMBER S.A.
Live alerts from global media, monitored by Business Radar
2025-04-24 (timestech.in)
Ansys and TSMC Expand Collaboration with Advanced Node Certifications and 3D-IC Design Solutions
Through continued collaboration with TSMC, Ansys, announced enhanced AI-assisted workflows for radio frequency 3D-IC Design.
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2024-01-16 (nextplatform.com)
Chip Packaging Trumps EDA: Why Synopsys Is Paying $35 Billion For Ansys
Here is how you know that the way chiplets are linked together to create what might have otherwise been a monolithic device is now more important than the
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2023-06-29 (nature.com)
Massively scalable Kerr comb-driven silicon photonic link
The growth of computing needs for artificial intelligence and machine learning is critically challenging data communications in today’s data-centre systems. Data movement, dominated by energy costs and limited ‘chip-escape’ bandwidth densities, is perhaps the singular factor determining the scalability of future systems. Using light to send information between compute nodes in such systems can dramatically increase the available bandwidth while simultaneously decreasing energy consumption. Through wavelength-division multiplexing with chip-based microresonator Kerr frequency combs, independent information channels can be encoded onto many distinct colours of light in the same optical fibre for massively parallel data transmission with low energy. Although previous high-bandwidth demonstrations have relied on benchtop equipment for filtering and modulating Kerr comb wavelength channels, data-centre interconnects require a compact on-chip form factor for these operations.
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2022-10-28 (engineering.com)
Ansys 3D-IC Power Integrity, Thermal Certified for TSMC 3Dblox -
PITTSBURGH, PA, Oct 28, 2022 – Ansys has collaborated with TSMC to certify that Ansys RedHawk-SC and Ansys Redhawk-SC Electrothermal are compliant with TSMC's 3Dblox standard for the exchange of design data between different tools in a 3D-IC design flow. The TSMC 3Dblox standard unifies its Open Innovation Platform (OIP) design ecosystem with qualified EDA tools and flows for TSMC 3DFabric, the world's most comprehensive family of 3D silicon stacking and advanced packaging technologies. RedHawk-SC and Redhawk-SC Electrothermal are also included in TSMC's Reference Flow for 3Dblox.
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2022-04-12 (eetasia.com)
Samsung Foundry Taps Synopsys and Ansys Co-developed Solution for Advanced-node, Energy-efficient Chips -
Samsung Foundry has achieved high silicon correlation with the jointly developed solution built on Synopsys PrimeTime signoff technology and Ansys RedHawk-SC.
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(datacentremagazine.com)
Enhancing Data Centers: Ansys, Supermicro, and NVIDIA Collaborate on Turnkey Solutions | Data Centre Magazine
Streamlining Data Center Operations: Ansys, Supermicro, and NVIDIA Introduce Turnkey Hardware Solutions
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