ANSYS HELLAS SINGLE MEMBER S.A.

Location

Sterea Ellada and Evoia

Founded

2000-07-11

Risk Signals

234 news mentions monitored

Industry Context

This company is tracked across risk categories, including those related to its sector (e.g., Computer Programming Services), including supply chain integrity, ESG practices, labor disputes, and regulatory compliance.

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Recent Articles about ANSYS HELLAS SINGLE MEMBER S.A.

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National Golden Gaucan University, 'Joint Research and Human Resources Fostering in Super Computing Fields'

2025-05-21 (veritas-a.com)

National Golden Gaucan University, 'Joint Research and Human Resources Fostering in Super Computing Fields'

[Veritas Alpha = Kim Ha -yeon Reporter] The National Gumgong University (CEO Kwak Ho -sang) signed a business agreement with ANSYS KOREA (CEO Joo -il Park) and Taesung SN (co -representative Shim Jin -wook/Park In -gyu) to jointly research and foster manpower in the supercomputing field.The ceremony was held in the middle of the university main hall on May 21 President Kwak Ho -sang and Joe

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Ansys Thermal and Multiphysics certified for Intel 18A process and 3D-IC designs -

2025-04-30 (engineering.com)

Ansys Thermal and Multiphysics certified for Intel 18A process and 3D-IC designs -

Ansys joins Intel alliance to support secure multi-die system design.

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Ansys, Kontrol, TÜV SÜD, Microsoft Launch Virtual Homologation Toolchain -

2024-12-30 (engineering.com)

Ansys, Kontrol, TÜV SÜD, Microsoft Launch Virtual Homologation Toolchain -

High-fidelity simulation is a key factor to ensure that simulation can be used as evidence in certification processes

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TSMC Recognizes Ansys for Excellence in Design Enablement for AI, HPC, and Photonics Silicon Systems

2024-10-25 (quantisnow.com)

TSMC Recognizes Ansys for Excellence in Design Enablement for AI, HPC, and Photonics Silicon Systems

Ansys won four TSMC 2024 OIP Partner of the Year awards, highlighting excellence in multiphysics analysis solutions for system design using advanced silicon processes and the rapidly evolving 3D-IC and silicon photonics packaging technologies / Key Highlights Ansys multiphysics analysis solutions are critical to the successful integration and performance of advanced multi-chip packaging and electronic and photonic co-packaged optics in TSMC's compact universal photonics engine (COUPE)Ansys' joint development of design solutions for TSMC's N2P and A16™ advanced silicon processes ensure power integrity, electromigration reliability, and critical thermal management for compute-heavy applicatio

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