ANSYS HELLAS SINGLE MEMBER S.A.
Location
Sterea Ellada and Evoia
Founded
2000-07-11
Website
Risk Signals
234 news mentions monitored
Industry Context
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Recent Articles about ANSYS HELLAS SINGLE MEMBER S.A.
Live alerts from global media, monitored by Business Radar
2025-05-26 (kyongbuk.co.kr)
We are fostering supercomputing talent in cooperation with Geumo Technology, Ansis and Taesung
The National University of Gyogong University signed a business agreement with ANSYS KOREA (CEO Park Joo -il) and Taesung SN (co -representative Shim Jin -wook and Park In -gyu) to jointly research and foster manpower in the supercomputing field. At the ceremony, Kwak Ho -sang, President of the National Ga -Gok University, Director of Super Computing Center, Taesung SN, CEO Jin -wook Shim
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2025-05-21 (autocarpro.in)
Ansys and BlueKei Partner to Advance Digital Engineering in India |
Collaboration focuses on integrating system engineering practices and Model-Based Systems Engineering (MBSE).
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2025-05-21 (cxotoday.com)
Ansys - BlueKei collaborate to Advance Digital Engineering in India
The parties have signed a memorandum of understanding (MOU) to establish a technology partnership to promote Digital Engineering practice. / Key Highlights Partnership to Accelerate MBSE Adoption in India To drive Simulation and Systems Engineering Innovation Ansys (NASDAQ: ANSS), a global leader in engineering simulation and BlueKei Solutions Pvt. Ltd, a leading consulting specializing in Digital Engineering […]
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2025-05-09 (thedollarbusiness.com)
Cyient partners ANSYS Inc to set up simulation lab
The Dollar Business BureauHyderabad-based Cyient on Wednesday announced it has signed an MoU with US-based ANSYS Inc to establish a simulation lab at Cyient's e
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2025-04-30 (engineering.com)
Ansys Thermal and Multiphysics certified for Intel 18A process and 3D-IC designs -
Ansys joins Intel alliance to support secure multi-die system design.
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2025-04-25 (chosun.com)
Park Joo-il leads Ansys Korea to tackle semiconductor challenges with Samsung collaboration -
Park Joo-il leads Ansys Korea to tackle semiconductor challenges with Samsung collaboration Park Joo-il drives Ansys Koreas partnership with Samsung t
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2025-04-24 (engineering.com)
Ansys expands collaboration with TSMC on design and process tools -
Ansys HFSS-IC Pro SoC electromagnetic solution is certified for TSMC's 5nm and 3nm process.
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2025-04-23 (convergedigest.com)
TSMC Certifies Ansys for Photonic and RF Design Flows -
Ansys and TSMC have expanded their partnership to deliver certified multiphysics solutions for the latest semiconductor process technologies, including TSMC's
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2025-04-02 (itbrief.com.au)
Gilmour Space partners with Ansys for first Aussie rocket
Gilmour Space Technologies has partnered with Ansys to advance the Eris rocket project, aiming to make history with Australia's first orbital launch.
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2024-12-30 (engineering.com)
Ansys, Kontrol, TÜV SÜD, Microsoft Launch Virtual Homologation Toolchain -
High-fidelity simulation is a key factor to ensure that simulation can be used as evidence in certification processes
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2024-10-28 (engineering.com)
TSMC Recognizes Ansys for Excellence in Design Enablement
Ansys received 4 awards for joint development of design solutions for multiphysics analysis, N2P and A16 power delivery, COUPE enablement, and RF design.
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2024-10-25 (quantisnow.com)
TSMC Recognizes Ansys for Excellence in Design Enablement for AI, HPC, and Photonics Silicon Systems
Ansys won four TSMC 2024 OIP Partner of the Year awards, highlighting excellence in multiphysics analysis solutions for system design using advanced silicon processes and the rapidly evolving 3D-IC and silicon photonics packaging technologies / Key Highlights Ansys multiphysics analysis solutions are critical to the successful integration and performance of advanced multi-chip packaging and electronic and photonic co-packaged optics in TSMC's compact universal photonics engine (COUPE)Ansys' joint development of design solutions for TSMC's N2P and A16™ advanced silicon processes ensure power integrity, electromigration reliability, and critical thermal management for compute-heavy applicatio
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